U-M Researchers Lead Effort to Advance Silicon Carbide Chip Technology

Researchers at the University of Michigan are leading a multimillion-dollar effort to advance silicon carbide chips.

February 24, 2025

Heat-Resistant Silicon Carbide Chips Revolutionize Aerospace and Energy

Silicon carbide (SiC) chips, known for their heat resistance, promise to enhance industries like aerospace, automotive, and renewable energy. Researchers at the University of Michigan lead a multimillion-dollar project to accelerate their market introduction. Funded by the Silicon Crossroads Microelectronics Commons Hub, the endeavor starts with $2.4 million, potentially reaching $7.5 million over three years.

Engineers at NASA’s Glenn Research Center have long explored SiC as a high-performance semiconductor. SiC devices endure higher voltages and temperatures than silicon. Notably, NASA developed a circuit that withstands 930 F (500 C), aiming for Venus exploration. SiC’s resilience is also valuable in electric vehicles and renewable energy, though underutilized in extreme conditions.

The project aims to modernize NASA’s SiC technology for wider use. Partners include GE Aerospace, Ozark Integrated Circuits, and Wolfspeed. A key focus is aerospace, enhancing aircraft engine reliability by optimizing size, weight, and power. A packaged actuator for aerospace applications is a primary goal.

Collaborating with Industry and Government

“NASA, GE Aerospace, and Ozark IC have done an amazing job,” said Becky Peterson, principal investigator and director of the U-M Lurie Nanofabrication Facility. “This project will advance and commercialize the technology.” NASA Glenn and GE Aerospace will scale the high-temperature SiC junction field effect transistor (JFET) fabrication process to 150-millimeter wafers.

Ozark IC supports packaging and integration, having worked with NASA on SiC technology. They aim to scale the technology with advanced packaging. Wolfspeed, a leader in SiC wafer production, will supply specialized wafers and consult on commercialization.

Michigan Engineering will refine process development kits and transistor models to make SiC technology more accessible. Researchers will test devices from NASA and GE Aerospace, working with Ozark IC on standardization.

David Wentzloff’s team will enhance open-source tools for designing analog and mixed-signal circuits, crucial for power management and sensor data conversion. This approach uses digital design tools for analog circuit design, speeding up development and broadening accessibility.

Enhancing Aerospace Engine Reliability

Silicon-based electronics in engines are limited to 257 F (125 C), requiring complex cooling systems. SiC electronics can operate in hotter areas, enabling lighter and simpler engine architectures. They can also advance hypersonic aircraft systems, which face extreme temperatures.

The project, titled “Improving Engine Reliability and SWAP with 350-500 C SiC Electronic Systems,” is among 34 initiatives funded by the U.S. Department of Defense through the Microelectronics Commons program. The University of Michigan is a founding member of the Silicon Crossroads Microelectronics Commons Hub.